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US 7,479,703 B1Granted
Integrated circuit package with sputtered heat sink for improved thermal performance
AssigneeLSI Logic Corporation
InventorZafer Kutlu
Life of this patent
Estimating the term…
Abstract
An integrated circuit package includes an integrated circuit die having a circuit surface and a back surface opposite the circuit surface. A layer of ductile material is deposited on the back surface of the integrated circuit die.
Claims11
An integrated circuit package comprising:
- an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
- and
- a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns;
- and
- solder bumps formed on the circuit surface of the integrated circuit die to electrically connect the integrated circuit die to a package substrate.
2 more elements
An integrated circuit package comprising:
- an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
- a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns;
- and
- an identification mark on the layer of ductile material.
1 more element
An integrated circuit package comprising:
- an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
- and
- a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns and comprising one of titanium, aluminum, copper, and gold.
An integrated circuit package comprising:
- an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
- and
- a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns and formed to conduct heat from the integrated circuit die.
An integrated circuit package comprising:
- an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
- and
- a layer of ductile material deposited on the back surface of the integrated circuit die, the layer of ductile material having a thickness of from one to five microns and formed to relieve tensile stress from the integrated circuit die.
A method of making an integrated circuit package comprising steps of:
- providing an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
- depositing a layer of ductile material on the back surface of the integrated circuit die, the layer of ductile material deposited to a thickness of from one to five microns;
- and
- forming solder bumps on the circuit surface of the integrated circuit die to electrically connect the integrated circuit die to a package substrate.
1 more element
A method of making an integrated circuit package comprising steps of:
- providing an integrated circuit die having a circuit surface and a back surface opposite the circuit surface;
- depositing a layer of ductile material on the back surface of the integrated circuit die, the layer of ductile material deposited to a thickness of from one to five microns;
- and
- making an identification mark on the layer of ductile material.
1 more element
An integrated circuit die comprising:
- a circuit surface and a back surface opposite the circuit surface;
- a layer of ductile material deposited on the back surface;
- and
- an identification mark on the layer of ductile material.
1 more element
Dependencies are inferred from the claim text.