Low thermal resistance assembly for flip chip applications
AssigneeAgere Systems Inc.
InventorsMark Adam Bachman, David L. Crouthamel
Life of this patent
Estimating the term…
Abstract
An assembly comprises a stiffener, a circuit substrate and an integrated circuit (IC) chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers the first region, while the IC chip overlies at least a portion of each of the first and second regions. Moreover, the assembly further comprises a plurality of first solder bumps and a plurality of second solder bumps. The first solder bumps contact both the IC chip and the circuit substrate. The second solder bumps are larger than the first solder bumps, contact the IC chip and are disposed above the second region of the stiffener.
Claims20
An assembly comprising:
- a stiffener, the stiffener having a surface with a first region and a second region;
- a circuit substrate, the circuit substrate covering the first region;
- an integrated circuit chip, the integrated circuit chip overlying at least a portion of each of the first and second regions;
- a plurality of first solder bumps, the first solder bumps contacting the integrated circuit chip and the circuit substrate;
- and
- a plurality of second solder bumps, the second solder bumps being larger than the first solder bumps, contacting the integrated circuit chip and being disposed above the second region;
- wherein the circuit substrate has an aperture formed therethrough over the second region;
- and
- wherein the plurality of second solder bumps are arranged within the aperture in the form of an array of solder bumps.
An apparatus including:
- an assembly, the assembly comprising:
- a stiffener, the stiffener having a surface with a first region and a second region;
- a circuit substrate, the circuit substrate covering the first region;
- an integrated circuit chip, the integrated circuit chip overlying at least a portion of each of the first and second regions;
- a plurality of first solder bumps, the first solder bumps contacting the integrated circuit chip and the circuit substrate;
- a plurality of second solder bumps, the second solder being larger than the first solder bumps and contacting the integrated circuit chip and the second region;
- wherein the circuit substrate has an aperture formed therethrough over the second region;
- and
- wherein the plurality of second solder bumps are arranged within the aperture in the form of an array of solder bumps;
- and
- a support structure, the support structure attached to the stiffener and operative to dissipate heat generated by the integrated circuit chip.
A method of forming an assembly, the method comprising the steps of:
- forming a stiffener, the stiffener having a surface with a first region and a second region;
- forming a circuit substrate, the circuit substrate covering the first region;
- forming an integrated circuit chip, the integrated circuit chip overlying at least a portion of each of the first and second regions;
- forming a plurality of first solder bumps, the first solder bumps contacting the integrated circuit chip and the circuit substrate;
- and
- forming a plurality of second solder bumps, the second solder bumps being larger than the first solder bumps, contacting the integrated circuit chip and being disposed above the second region;
- wherein the circuit substrate has an aperture formed therethrough over the second region;
- and
- wherein the plurality of second solder bumps are arranged within the aperture in the form of an array of solder bumps.
Dependencies are inferred from the claim text.