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US 7,479,692 B2Granted
Integrated circuit package system with heat sink
AssigneeSTATS ChipPAC, Ltd.
InventorsAntonio B. Dimaano, Jr., Il Kwon Shim, Henry D. Bathan, Jeffrey D. Punzalan
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system is provided including forming a paddle, forming a ring with a recess in the paddle, mounting a device in the recess, forming a slot in the ring, and mounting a heat sink in the slot over the device.
Claims20
An integrated circuit package system comprising:
- forming a paddle with a landing pad and external interconnects therearound, the paddle and the landing pad have co-planar surfaces;
- forming a recess in the paddle to form a ring around the paddle;
- mounting a device in the recess;
- forming a slot in the ring;
- and
- mounting a heat sink over the device to the landing pad or in the slot.
3 more elements
An integrated circuit package system comprising:
- forming a die-attach paddle with landing pads and external interconnects therearound, the paddle and the landing pads have co-planar surfaces;
- forming a recess in the die-attach paddle to form a ring, having a plating, around the die-attach paddle;
- mounting an integrated circuit die connected to the plating and in the recess;
- forming a slot in the ring;
- and
- mounting a heat sink over the integrated circuit die to the landing pads or in the slot.
3 more elements
An integrated circuit package system comprising:
- a paddle with a landing pad, the paddle and the landing pad having co-planar surfaces, the paddle having a recess in the paddle to form a ring around the paddle, the ring having a slot therein;
- external interconnects around the paddle;
- a device in the recess;
- and
- a heat sink over the device mounted to the landing pad or in the slot.
2 more elements
Dependencies are inferred from the claim text.