Power semiconductor module having surface-mountable flat external contacts and method for producing the same

A method for producing a power semiconductor module comprising surface-mountable flat external contacts oriented in plane fashion on the underside of the plastic housing, the method comprising:

• producing an arrangement of flat external contacts for the surface-mountable semiconductor module in a flat conductor frame, the top sides of the external contacts being oriented in plane fashion and forming a coplanar housing plane;
• producing a semiconductor chip, the top side of the semiconductor chip comprising source contact areas and gate contact areas and the rear side of the semiconductor chip comprising a drain contact area;
• fixing the semiconductor chip by its drain contact area on a top side of a drain external contact of the flat conductor frame;
• applying a patterned insulation layer to the edge sides and the top side of the semiconductor chip and to the coplanar housing plane whilst leaving free the source and gate contact areas and whilst partly leaving free the top sides of the external contacts;
• applying a patterned metal layer as a planar connecting layer (21, 22) between source contact areas and surfaces of the source external contacts, and also between gate contact areas and surfaces of the gate external contacts;
• and
• embedding the previously assembled components into a plastic housing composition, external contacts projecting from the plastic housing composition with their external contact areas on the underside of the plastic housing.