Semiconductor device

A semiconductor device comprising:

• a semiconductor substrate having a first surface with electrode pads and circuit blocks including an analog circuit;
• a shield layer including a plurality of strip metallic conductors which are disposed at predetermined intervals over the analog circuit and which are electrically connected to one another;
• a resin layer over the first surface of the semiconductor substrate and the shield layer, the resin layer being disposed directly on the strip metallic conductors;
• and
• external terminals electrically connected to the electrode pads.

A semiconductor device, comprising:

• a substrate having a plurality of circuit blocks and electrode pads that are disposed at predetermined pad positions and that are electrically connected to the electrode pads, the circuit blocks including a particular circuit block;
• redistribution conductors that are disposed in a common plane and that extend from locations over the pad positions to connection post positions;
• a conductive shield section over the particular circuit block, the shield section lying in the common plane;
• connection posts having upper and lower ends;
• the lower ends being connected to the redistribution conductors at the connection post positions;
• and
• a resin layer that contacts the redistribution conductors and the shield section, the connection posts extending through the resin layer,
• wherein the particular circuit block comprises analog circuitry.