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US 7,479,659 B2Granted
Process for manufacturing encapsulated optical sensors, and an encapsulated optical sensor manufactured using this process
AssigneeSTMicroelectronics S.r.l.
InventorsCarlo Cognetti, Ubaldo Mastromatteo
Life of this patent
Estimating the term…
Abstract
A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors in a wafer of semiconductor material; bonding a plate of transparent material to the wafer so as to seal the optical sensors; and dividing the wafer into a plurality of dies, each comprising an optical sensor and a respective portion of the plate.
Claims18
An encapsulated optical sensor, comprising:
- a substrate of semiconductor material having a surface;
- a plurality of photodetectors formed in said substrate and operable to sense light that is incident on the surface;
- a chip of transparent material, carried by said surface of said substrate and sealing said photodetectors;
- and
- at least one through interconnection traversing the substrate, the through interconnection comprising a conductive region insulated from said substrate by a respective insulating structure.
2 more elements
An encapsulated optical sensor, comprising:
- a substrate of semiconductor material;
- a plurality of photodetectors formed in said substrate;
- a plurality of through interconnections traversing said substrate;
- a chip of transparent material, carried by said substrate and sealing said photodetectors;
- and
- wherein each of said through interconnections comprises a conductive region insulated from said substrate by means of a respective insulating structure.
3 more elements
An integrated circuit comprising:
- a semiconductor substrate having a first surface;
- an optical sensor disposed in the substrate and operable to sense light that strikes the first surface of the substrate;
- a frame disposed on the first surface of the substrate around the optical sensor;
- a transparent plate bonded to the frame adjacent to the first surface of the substrate and sealing the optical sensor;
- and
- an interconnect disposed in the substrate, and including
- a conductor, and
- an electrical insulator disposed between the substrate and the conductor;
- wherein the semiconductor substrate comprises a second surface that is opposite to the first surface;
- wherein the optical sensor comprises a conductive contact disposed on one of the first and second surfaces;
- wherein the interconnect extends from the first surface to the second surface;
- and
- a conductor that electrically couples the conductive contact to the conductor of the interconnect.
10 more elements
An integrated circuit, comprising:
- a semiconductor substrate;
- an optical sensor disposed in the substrate;
- a frame disposed on the substrate around the optical sensor;
- a transparent plate bonded to the frame and sealing the optical sensor;
- and
- a plurality of through interconnections traversing the substrate, each of the through interconnections including a conductive region insulated from the substrate by means of a respective insulating structure.
3 more elements
An integrated circuit, comprising:
- a semiconductor substrate;
- an optical sensor disposed in the substrate;
- a frame disposed on the substrate around the optical sensor;
- a transparent plate bonded to the frame and sealing the optical sensor;
- and
- a plurality of through interconnects traversing the substrate, each of the through interconnects including a respective conductive region insulated from the substrate by a respective insulating structure.
3 more elements
Dependencies are inferred from the claim text.