Semiconductor device having transparent member and manufacturing method of the same
AssigneeFujitsu Microelectronics Limited
InventorsKazuhiro Yoshimoto, Yuzo Shimobeppu, Kazuo Teshirogi, Yoshiaki Shinjo
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Abstract
A semiconductor device, includes a semiconductor substrate having a main surface where a light receiving element area is formed; a projection part provided in the periphery of the light receiving element area on the main surface of the semiconductor substrate; an adhesive material layer provided in the external periphery of the projection part on the main surface of the semiconductor substrate; and a transparent plate supported by the projection part and fixed above the light receiving element area by the adhesive material layer.
Claims11
A semiconductor device, comprising:
- a semiconductor substrate having a main surface where a light receiving element area is formed;
- a projection part provided in the periphery of the light receiving element area on the main surface of the semiconductor substrate;
- an adhesive material layer provided in the external periphery of the projection part on the main surface of the semiconductor substrate;
- a transparent plate supported by the projection part and fixed above the light receiving element area by the adhesive material layer, wherein the projection part comes in contact with a lower surface of the transparent plate;
- the projection part and the transparent plate are made of materials different from each other;
- wherein the projection part is formed by a first projection part and a second projection part;
- and the adhesive layer is provided between the first projection part and the second projection part;
- wherein the semiconductor substrate is fixed to a supporting substrate;
- a piercing electrode electrically connecting the semiconductor substrate and the supporting substrate is formed so as to pierce inside of the semiconductor substrate;
- and the piercing electrode is provided in the semiconductor substrate between the first projection part and the second projection part.
Dependencies are inferred from the claim text.