Dry adhesives, methods of manufacture thereof and articles comprising the same
AssigneeInternational Business Machines Corporation
InventorJoseph Kuczynski
Life of this patent
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Abstract
Disclosed herein is a printed circuit board comprising a laminate that comprises a copper foil; inorganic or metallic nanoparticles having an average diameter of less than 100 nanometers disposed on a surface of the copper foil; the nanoparticles being arranged in domains; the domains having average domain sizes of about 10 to about 100 nanometers and average interdomain spacings of 10 to about 1,000 nanometers; the nanoparticles not facilitating the transfer of an electrical current; a layer of solid organic polymer disposed on the nanoparticles; the layer of the organic polymer being bounded to the nanoparticles by van der Waals forces; the laminate being employed in a printed circuit board.
Claims2
A printed circuit board comprising:
- a laminate that comprises:
- a copper foil;
- nanoparticles having diameters of less than or equal to about 100 nanometers disposed on a surface of the copper foil;
- the nanoparticles being arranged in domains;
- the domains having average domain sizes of about 10 to about 100 nanometers and average interdomain spacings of 10 to about 1,000 nanometers;
- the nanoparticles not facilitating the transfer of an electrical current, wherein the nanoparticles are nanorods, nanoribbons, carbon nanotubes, or a combination comprising at least one of the foregoing nanoparticles;
- a first layer of solid organic polymer disposed on the nanoparticles;
- the layer of the organic polymer being bounded to the nanoparticles by van der Waals forces;
- the laminate being employed in a printed circuit board;
- and
- a second layer of organic polymer disposed on a surface of the copper foil that is opposed to the surface containing the nanoparticles.
Dependencies are inferred from the claim text.