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US 7,479,534 B2Granted
One-component epoxy resin composition
AssigneeAjinomoto Co., Inc.
InventorsHiroshi Amano, Osamu Yamabe, Hiroyasu Koto
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Abstract
The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.
Claims29
A method of making a completely liquid one-component epoxy resin composition, which is homogeneous at room temperature,
- said method comprising:
- (a) mixing a compound that releases a basic component under a curing temperature condition with a polythiol compound having 2 or more thiol groups in the molecule, wherein said compound that releases a basic component under a curing temperature condition is soluble in said polythiol compound having 2 or more thiol groups in the molecule, to obtain a mixture;
- (b) heating said mixture, to obtain a uniform solution;
- (c) cooling said uniform solution, to obtain a cooled solution;
- (d) adding a compound having Lewis acidity and an epoxy resin having 2 or more epoxy groups in the molecule to said cooled solution, to obtain said completely liquid one-component epoxy resin composition.
2 more elements
Dependencies are inferred from the claim text.