Polyepoxide and reaction product of aminoalkylimidazole, polyamine, urea and diepoxide as curing component

Abstract

A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a property of generating outgas in a smaller amount, and providing cured product with an excellent heat resistance, is provided. The composition comprises 100 parts by weight of (A) an epoxide having more than one epoxy group on average in the molecule, and 1 to 40 parts by weight of (B) a curing compound which is prepared by reacting with heating (a) aminoalkylimidazole of the general formula: (b) an amine having two nitrogen atoms with one or two active hydrogen atoms and having at least one cyclic structure group in the molecule therein, (c) urea, and (d) a diepoxide having two epoxy groups on average in the molecule.

Dependencies are inferred from the claim text.