Low dielectric organosilicate polymer composite
AssigneePostech Foundation
InventorsMoonhor Ree, Weontae Oh, Yong Taek Hwang, Byeongdu Lee
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Abstract
Provided are a porous organosilicate polymer composite prepared by heating an organic/inorganic hybrid polymer in which an organosilicate polymer is chemically bonded to a radial pore-forming polymer ended with a hydrolyzable alkoxysilyl group and used as a core molecule, and a semiconductor device using an organosilicate polymer composite film including the porous organosilicate polymer composite. The organosilicate polymer composite film has a very low dielectric constant, and thus, is useful as a dielectric film of the semiconductor device.
Claims12
A porous organosilicate polymer composite prepared by heating an organic/inorganic hybrid polymer in which an organosilicate polymer is chemically bonded to a radial pore-forming polymer ended with a hydrolyzable alkoxysilyl group and used as a core molecule, wherein the hydrolyzable alkoxysilyl group of the radial pore-forming polymer is —CONH—(CH2)3—Si(OC2H5)3, —CH2CH(CH3)—CH2O(CH2)3—Si(CH3)2(OC2H5), —CH2CH(OH)—CH2O(CH2)3—Si(CH3)(OC2H5)2, or —CH2CH(OH)—CH2O(CH2)3—Si(CH3)(OCH3)2.
Dependencies are inferred from the claim text.