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US 7,479,409 B2Granted
Integrated circuit package with elevated edge leadframe
AssigneeSTATS ChipPAC, Ltd.
InventorsZigmund Ramirez Camacho, Henry D. Bathan, Jose Alvin Caparas, Jeffrey D. Punzalan
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes an elevated edge leadframe array, isolating leadframes of the elevated edge leadframe array, validating integrated circuit die attached to the leadframes, and forming integrated circuit packages including the integrated circuit die.
Claims20
An integrated circuit packaging method comprising:
- providing an elevated edge leadframe array;
- isolating leadframes of the elevated edge leadframe array;
- validating integrated circuit die attached to the leadframes;
- and
- forming integrated circuit packages including the integrated circuit die.
2 more elements
An integrated circuit packaging method comprising:
- providing an elevated edge leadframe array having a bent edge;
- cutting leadframes of the elevated edge leadframe array for testing;
- testing integrated circuit die attached and electrically connected to the leadframes;
- and
- singulating integrated circuit packages including the integrated circuit die and the leadframes.
2 more elements
An integrated circuit package system comprising:
- an elevated edge leadframe array;
- leadframes of the elevated edge leadframe array;
- integrated circuit die attached to the leadframes;
- and
- integrated circuit packages including the integrated circuit die.
2 more elements
Dependencies are inferred from the claim text.