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US 7,479,402 B2Granted
Comb structure fabrication methods and systems
AssigneeHoneywell International Inc.
InventorLianzhong Yu
Life of this patent
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Abstract
A method of manufacturing a vertical comb structure for a micro electromechanical (MEMS) device. Tooth structures are formed on a first wafer. A second wafer is then bonded to the tooth structures of the first wafer. The tooth structures are then released to form a comb structure. Forming the tooth structures on the first wafer includes using oxidation, photolithography, etching, epitaxy, and chemical and mechanical polishing to create the tooth structures on the first wafer.
Claims15
A method comprising:
- creating a complete tooth structure on a first wafer;
- bonding a second wafer to the tooth structure to create a comb structure;
- and
- releasing the comb structure,
- wherein creating includes:
- oxidizing a surface of the first wafer to create a first insulating layer;
- selectively removing portions of the first insulating layer using masking, photolithography, and etching;
- depositing a first device layer on the first insulating layer and first wafer using epitaxy;
- oxidizing a surface of the first device layer to create a second insulating layer;
- selectively removing portions of the second insulating layer using at least one of chemical and mechanical polishing;
- and
- selectively removing portions of the first device layer using masking, photolithography, and etching to form a first set of teeth being attached to a surface of the first wafer and to form a second set of teeth interspersed with the first set of teeth, the second set of teeth being attached to the first insulating layer between the second set of teeth and the surface of the first wafer.
9 more elements
A method comprising:
- creating a complete tooth structure on a first wafer;
- bonding a second wafer to the tooth structure to create a comb structure;
- releasing the comb structure, wherein the releasing includes:
- forming through holes in the second wafer from a top surface of the second wafer to a bottom surface of the second wafer using masking, photolithography, and etching;
- and
- introducing an etchant into the comb structure;
- and
- sealing the holes after releasing.
5 more elements
Dependencies are inferred from the claim text.