Front side illuminated photodiode with backside bump

A method of fabricating an opto electronic device, the method comprising:

• forming an optoelectronic device on a front side of a semiconductor wafer;
• forming at least one electrical contact on the front side of the semiconductor wafer, wherein the electrical contact on the front side is electrically coupled to the optoelectronic device;
• and
• mounting the semiconductor wafer with the optoelectronic device upside down on a support carrier before forming at least one electrical contact on a backside of the semiconductor wafer.

A method of fabricating an array of optoelectronic devices, the method comprising:

• forming an array of optoelectronic devices on a front side of a semiconductor wafer;
• forming an array of first contacts on the front side of the semiconductor wafer, wherein the first contacts are electrically coupled to the respective optoelectronic devices;
• and
• mounting the semiconductor wafer upside down on a support carrier before forming an array of vias through the semiconductor wafer and an array of second contacts on a backside of the semiconductor wafer, wherein the array of vias electrically couple the array of second contacts to the array of first contacts.