System and method for providing automated sample preparation for plan view transmission electron microscopy

A method for preparing a sample wafer for plan view transmission electron microscopy, the method comprising:

• microcleaving a sample wafer from a semiconductor wafer with an automated diamond sawing tool, the step of microcleaving further comprising,
• marking a selected location on the sample wafer with a diamond scribe, and
• cleaving the sample wafer at the marked location with the diamond sawing tool;
• cutting the sample wafer with the automated diamond sawing tool to expose a cross sectional view surface of a first remaining portion of the sample wafer;
• mounting the first remaining portion in an orientation for plan view imaging;
• and
• cutting the first remaining portion with the automated diamond sawing tool to expose a plan view surface of a second remaining portion of the sample wafer.

A semiconductor wafer test sample prepared for plan view transmission electron microscopy, the test sample manufactured by:

• microcleaving a sample wafer from a semiconductor wafer;
• cutting the sample wafer to expose a cross sectional view surface of a first remaining portion of the sample wafer;
• mounting the first remaining portion in an orientation for plan view imaging on a support stub;
• cutting the first remaining portion and the support stub to expose a plan view surface of a second remaining portion of the sample wafer;
• clamping a focused ion beam (FIB) clamp to a stub holder fixture that supports the support stub;
• and
• cutting the test sample from the support stub, wherein the test sample comprises a portion of the second remaining portion of the sample wafer and a portion of the support stub.