Methods and apparatus for packaging integrated circuit devices

A method of producing integrally packaged optronic integrated circuit devices, comprising:

• providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
• forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
• separating said integrated circuit dies from each other along said dice lines so as to define edge surfaces of said dies while said dies remain attached to said packaging layer;
• forming first and second electrical conductors overlying at least one of said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surfaces of said dies;
• and
• severing said packaging layer and defining a plurality of packaged optronic integrated circuit devices.

A method of producing integrally packaged optronic integrated circuit devices, comprising:

• providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
• forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
• separating said integrated circuit dies from each other along said dice lines so as to define edge surfaces of said dies;
• and
• forming first and second electrical conductors overlying said second generally planar surface and said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surface of said dies.

A method of producing integrally packaged optronic integrated circuit devices, comprising:

• providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
• forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
• separating said integrated circuit dies from each other along said dice lines so as to define edge surfaces of said dies;
• and
• forming first and second electrical conductors overlying at least one of said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surfaces of said dies.

A method of producing integrally packaged optronic integrated circuit devices, comprising:

• providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
• forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
• processing said wafer to define edge surfaces of said dies while said dies remain attached to said packaging layer so as to define edge surfaces of said dies while said dies remain attached to said packaging layer;
• forming first and second electrical conductors overlying said second generally planar surface and said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surface of said dies;
• and
• severing said package layer and defining a plurality of packaged optronic integrated circuit devices.

A method of producing integrally packaged optronic integrated circuit devices, comprising:

• providing a wafer having first and second generally planar surfaces, the wafer including a plurality of integrated circuit dies attached together at dice lanes, each die including first and second pads adjacent to said first generally planar surface, and optronic semiconductor circuitry between said first and second generally planar surfaces;
• forming a packaging layer over said semiconductor circuitry and said first generally planar surface;
• processing said wafer to define edge surfaces of said dies while said dies remain attached to said packaging layer so as to define edge surfaces of said dies while said dies remain attached to said packaging layer;
• forming first and second electrical conductors overlying at least one of said edge surfaces, said first and second electrical conductors connected to said circuitry, said electrical conductors contacting portions of said pads projecting beyond said edge surfaces of said dies;
• and
• severing said packaging layer and defining a plurality of packaged optronic integrated circuit devices.