Optoelectronics processing module and method for manufacturing thereof
AssigneeGigno Technology Co., Ltd.
InventorShuan Ta Liu
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Abstract
An optoelectronics processing module includes a transparent substrate and at least one optoelectronics component. One surface of the transparent substrate is formed with a plurality of first pads and a plurality of second pads. The optoelectronics component mounted on the transparent substrate has a plurality of connecting pads, which is irradiated with a laser beam and is then connected with the first pads.
Claims10
A method for manufacturing an optoelectronics processing module, which is for connecting an optoelectronics component to a transparent substrate, wherein the optoelectronics component has a plurality of connecting pads and one surface of the transparent substrate has a plurality of first pads and a plurality of second pads for external connection, the method comprising:
- bonding the optoelectronics component to the transparent substrate, wherein the connecting pads are respectively aligned to the first pads of the transparent substrate;
- and
- illuminating a laser beam from a side of the transparent substrate to irradiate the connecting pads and the first pads so as to connect the connecting pads and the corresponding first pads.
Dependencies are inferred from the claim text.