Adhesive sheet roll for wafer processing
AssigneeNitto Denko Corporation
InventorsKouichi Hashimoto, Kazuhiko Yamamoto
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Abstract
An adhesive film in roll for wafer processing is constituted by laminated multiple layers including a base film, a radiation curing type adhesive layer, and a releasing film in this sequence, in which the arithmetic average roughness (Ra) of the side of the base film and/or releasing film opposite to the radiation curing type adhesive layer is 1 μm or more, and the weight of the radical polymerization initiator contained in the radiation curing type adhesive layer is less than 1000 ppm.
Claims21
An adhesive sheet roll for wafer processing comprising a base film, radiation curing type adhesive layer, and releasing film in this sequence, wherein the arithmetic average roughness (Ra) of the other surface of the side of the base film and/or releasing film contacting with the radiation curing type adhesive layer is 1 μm or more, wherein the radiation curing type adhesive layer comprises a radical polymerization inhibitor, and wherein the weight of the radical polymerization inhibitor contained in the radiation curing type adhesive layer is more than 10 ppm and less than 1000 ppm, wherein the ten-point average roughness (Rz) of the other surface of the side of the base film and/or releasing film contacting with the radiation curing type adhesive layer is 12 μm or more, and
- wherein the adhesive sheet roll is configured to suppress radical polymerization chain reaction during storage of the adhesive sheet roll.
An adhesive sheet roll for wafer processing which laminates multiple layers of laminated film stacking up base film, radiation curing type adhesive layer, and releasing film in this sequence, wherein a set-off film is laminated on the other side of the base film or releasing film contacting with the radiation curing type adhesive layer, and the arithmetic average roughness (Ra) of the surface of one side or both sides of the set-off film is 1 μm or more, wherein the radiation curing type adhesive layer comprises a radical polymerization inhibitor, and wherein the weight of the radical polymerization inhibitor contained in the radiation curing type adhesive layer is more than 10 ppm and less than 1000 ppm, wherein said set-off film separates the base film of a first layer of the laminated film and the releasing film of a second layer of the laminated film wherein said first and second layers of the laminated film represent adjacent layers of the laminated film when the laminated film is wound in the adhesive sheet roll, wherein the ten-point average roughness (Rz) of one side or both sides of the set-off film is 12 μm or more, and
- wherein the adhesive sheet roll is configured to suppress radical polymerization chain reaction during storage of the adhesive sheet roll.
A roll of an adhesive sheet for wafer processing, wherein an inner surface of the adhesive sheet is in contact with an outer surface of the adhesive sheet, said adhesive sheet being constituted by laminated multiple layers comprising:
- (i) a base film;
- (ii) a radiation curing type adhesive layer formed on top of the base film;
- and (iii) a releasing film formed on top of the adhesive layer,
- wherein at least one of the inner surface and the outer surface of the adhesive sheet which are in contact with each other has an arithmetic average roughness (Ra) of 1 μm or higher to form an air layer therebetween, and the radiation curing type adhesive layer contains a radical polymerization inhibitor in an amount of less than 1000 ppm by weights,
- wherein the at least one of the inner surface and the outer surface of the adhesive sheet has a ten-point average roughness (Rz) of 12 μm or higher, and
- wherein the adhesive sheet roll is configured to suppress radical polymerization chain reaction during storage of the adhesive sheet roll.
Dependencies are inferred from the claim text.