Method of manufacturing a multi-layered wiring board
AssigneeSeiko Epson Corporation
InventorHirotsuna Miura
Life of this patent
Estimating the term…
Abstract
There provided a method of manufacturing a multi-layered wiring board having at least two conductor layers, an interlayer insulation layer provided between the conductor layers, and a conductor post that electrically connects the conductor layers, on a substrate. In the method, the conductor post is formed by repeatedly performing: coating a droplet containing a conductive material, applying light energy to the coated droplet, and accumulating and coating a subsequent droplet on the droplet to which the light energy is applied.
Claims7
A method of manufacturing a multi-layered wiring board having at least two conductor layers, an interlayer insulation layer provided between the conductor layers, and a conductor post that electrically connects the conductor layers, on a substrate, the method comprising:
- discharging a first droplet containing a conductive material from a discharge head;
- piling successive droplets on the first droplet to form the conductor post;
- and
- applying light energy from a laser light source to the piled droplets between successive droplets as the droplets are piled on the conductor post and during discharge of subsequent droplets from the discharge head;
- moving an optical element of the laser light source based on a position of a top droplet disposed on the conductor post;
- and
- changing a focal position of the laser light source to a crown of the top droplet;
- wherein less light energy is applied to droplets piled on the conductor post than is applied to the first droplet disposed on the substrate;
- and
- wherein the light energy is applied to the discharged droplet before the droplet spreads by wetting at a landing portion of the substrate.
Dependencies are inferred from the claim text.