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AssigneeEbara Corporation
InventorsMizuki Nagai, Hiroyuki Kanda, Keiichi Kurashina, Satoru Yamamoto, Hidenao Suzuki, Koji Mishima, Brett C. Baker-O'Neal, Hariklia Deligianni, Keith Kwietniak
Estimating the term…
A plating method is capable of preferentially precipitating a plated film fully and uniformly in trenches and via holes according to a mechanical and electrochemical process, and of easily forming a plated film having higher flatness surface without being affected by variations in the shape of trenches and via holes. The plating method includes a first plating process and a second plating process. The second plating process is performed by filling a plating solution between an anode and a substrate, with a porous member placed in the plating solution, repeatedly bringing the porous member and the substrate into and out of contact with each other, passing a current between the anode and the substrate while the porous member is being held in contact with the substrate.
A method of embedding an interconnect material in an interconnect recess formed in a surface of a substrate by electroplating, comprising:
A plating method of embedding an interconnect material in an interconnect recess formed in a surface of a substrate by electroplating, said method comprising:
Dependencies are inferred from the claim text.