Lamination of dry film to micro-fluid ejection head substrates
AssigneeLexmark International, Inc.
InventorsDavid L. Bernard, Christopher A. Craft, Gary R. Williams
Life of this patent
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Abstract
A method of making a micro-fluid ejection head structure and structures made by the method. The method includes planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation. A polymeric nozzle layer is laminated to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.
Claims19
A method of bonding a deformable film to a fluid flow structure in order to inhibit blocking of flow paths in the fluid flow structure comprising:
- positioning a fluid flow structure on a first electrostatic chuck support surface;
- positioning the deformable film on a second electrostatic chuck support surface;
- and
- moving the first and second electrostatic chuck support surfaces toward one another to thermally bond the fluid flow structure and deformable film to one another;
- whereby electrostatic forces inhibit deformation of portions of the film into the flow paths of the fluid flow structure.
A method of making a micro-fluid ejection head structure comprising:
- planarizing a heated substrate component of a micro-fluid ejection head structure by applying a clamping voltage to an electrostatic chuck sufficient to hold the substrate component in a planarized orientation while laminating a polymeric nozzle layer to the heated substrate component in a manner sufficient to provide a planarized nozzle layer on the substrate component.
Dependencies are inferred from the claim text.