US 7,479,202 B1Granted

Bubble-free techniques for bonding substrates

AssigneesAnwell Precision Technology (HK) Limited, Dongguan Anwell Digital Machinery Ltd.

InventorsKai Leung Fan, Ming Sang Yeung

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Abstract

Techniques for producing optical medium that can be read at substantially high speeds with greater stability and accuracy are disclosed. According to one aspect of the techniques, a bonding station is employed with what is referred to as a bubble-free bonding technique that may or may not be incorporated with an index bonding technique. The index bonding is provided to ensure that non-flatness of substrates is compensated when two substrates are bonded together so as to minimize possible dynamic imbalance of a disc. The bubble-free bonding technique is provided to generate an alternating electromagnetic field that eliminates bubbles from a type of glue used to bond two substrates, wherein a high voltage source is used to generate the alternating electromagnetic field of a predefine magnitude.

Claims20

Dependent claims

A method for bonding substrates, the method comprising:

receiving a first substrate and a second substrate from a convey belt running at a speed being programmed via a first control means in accordance with characteristics of a material used to produce the substrates so as to ensure that first and second substrates are hardened properly;
metalizing at least one of the first and second substrates;
dispensing a certain amount of glue on the first substrate;
pushing the first substrate and the second substrate towards each other;
and
applying an alternating source to generate an alternating electromagnetic field that consequently breaks down a surface tension of the glue to release air trapped in the glue;
rotating the first and second substrates at a speed adapted to the characteristics of the glue to spread evenly the glue therebetween by a centrifugal force while compressing the first and second substrates for bonding under the alternating electromagnetic field, wherein said rotating the first and second substrates is controlled by a second control means in accordance with the characteristics of the glue being used;
and
providing at least one camera to monitor one or more of said receiving the first substrate and the second substrate from the convey belt, said metalizing at least one of the first and second substrates, and a bonding process including above said dispensing, said pushing, said applying and said rotating processes.

6 more elements

A method for bonding substrates, the method comprising:

receiving a first substrate and a second substrate from a convey belt running at a speed being programmed via a first control means in accordance with characteristics of a material used to produce the substrates so as to ensure that first and second substrates are hardened properly;
metalizing at least one of the first and second substrates;
adjusting the first substrate by an angle with respect to the second substrate to minimize possible dynamic imbalance of a disc including the first and second substrates;
dispensing a certain amount of glue on the first substrate;
pushing the first substrate towards the second substrate during a predefined time to let the dispensed glue to spread naturally;
creating an alternating electromagnetic field to the first and second substrates to break down a surface tension of the glue so as to eliminate possible bubbles in the glue;
and
rotating the first and second substrates together at a speed adapted to the characteristics of the glue to spread evenly the glue between the first and second substrates by a centrifugal force while the first and second disks are being bonded by compressing the first and second substrates for bonding under the alternating electromagnetic field, wherein said rotating the first and second substrates together is controlled by a second control means in accordance with the characteristics of the glue being used;
and
providing at least one camera to monitor one or more of said receiving the first substrate and the second substrate from the convey belt, said metalizing at least one of the first and second substrates, and a bonding process including above said dispensing, said pushing, and said rotating processes.

7 more elements

A method for bonding substrates, the method comprising:

dispensing a certain amount of glue on a first substrate from a glue nozzle positioned above the substrate while keeping the first substrate rotated so that a circular glue ring is formed thereon;
a lower holder for holding the first substrate;
an upper holder for holding a second substrate;
an alternating power source applied to generate an alternating electromagnetic field between the first and second substrates when the first and second substrates are pushed towards each other, wherein the alternating electromagnetic field is strong enough to break down a surface tension of the glue so as to eliminate possible bubbles in the glue,
wherein both of the lower and upper holders rotate the first and second substrates together at a speed adapted to the characteristics of the glue to spread evenly the glue ring outwards from the inner opening by a centrifugal force while the first and second substrates are being compressed for bonding under the alternating electromagnetic field, wherein said rotating the first and second substrates together is controlled by a control means in accordance with the characteristics of the glue being used;
and
one or more cameras provided to monitor a bonding process including above said dispensing and said rotating processes, wherein images from the one or more cameras are digitalized, encoded, compressed and transported via a network to monitors remotely located.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/292,919Filed 2 Dec 2005 · continuation in part
Priority: 28 Jun 2005
Granted: 20 Jan 2009
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

B32B 37/003
Involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality: to avoid air inclusion
B29C 65/521
Characterised by the way of applying the adhesive: by spin coating
B29C 66/1162
Single bevelled joints, i.e. one of the parts to be joined being bevelled in the joint area: single bevel to bevel joints, e.g. mitre joints
B29C 66/342
General aspects dealing with the joint area or with the area to be joined: preventing air-inclusions