Semiconductor device socket

A semiconductor device socket for electrically connecting between a semiconductor device and a printed-wiring board, the semiconductor device socket comprising:

• a socket body having contacts to be electrically connected with the semiconductor device;
• a pitch-changing board having a plurality of contact holes in which the contacts of the socket body are inserted respectively, and a plurality of pads conductively wired from the contact holes at a pitch greater than the pitch of the contacts of the socket body, and
• a connection mechanism provided between the socket body and the printed-wiring board, including connection members for electrically connecting between the contacts and pads of the printed-wiring board through the pitch-changing board and an alignment plate having a cylindrical through-hole in which one of the connection members is provided;
• wherein
• each connection member provided in the through-hole has a first spring portion having a first free end, a circular support portion having an outer diameter greater than an inner diameter of the through-hole, a positioning portion having an outer diameter smaller than said inner diameter of the through-hole and a second spring portion having a second free end,
• the first and second spring portions are coil springs, the second spring portion has an outer diameter smaller than the inner diameter of the through-hole so as to vertically move within the through-hole,
• the first free end of each first spring portion electrically connects with the corresponding pad of the pitch-changing board and the second free end of each second spring portion electrically connects with the corresponding pad of the printed-wiring board,
• the circular support portion abuts against the outer surface of the alignment plate on opposite sides when the positioning portion and the second spring portion of the connection member are inserted in the through-hole, thereby the connection member being retained on the alignment plate,
• wherein the semiconductor device socket, the pitch-changing board and the alignment plate are assembled on the printed-wiring board by means of a fixing mechanism structured by bolts and nuts.

A semiconductor device socket for electrically connecting between a semiconductor device and a printed-wiring board, the semiconductor device socket comprising:

• a socket body having contacts to be electrically contacted with the semiconductor device;
• and
• a connection mechanism provided between the socket body and the printed-wiring board, including connection members for electrically connecting between the contacts and pads of the printed-wiring board and an alignment plate, wherein
• the alignment plate includes a cylindrical through-hole in which one of the connection members is provided,
• the connection member provided in the through-hole includes a first spring portion having a first free end, a second spring portion having an outer diameter smaller than an inner diameter of the through-hole and having a second free end a positioning portion having an outer diameter smaller than the inner diameter of the through-hole, and a circular support portion comprising a length of wire shaped to support the first and second spring portions,
• an outer diameter of the circular support portion is greater than an inner diameter of the through-hole, and
• the circular support portion abuts against the outer surface of the alignment plate on opposite sides when the positioning portion and the second spring portion of the connection member are inserted in the through-hole, thereby the connection member being retained on the alignment plate.

A semiconductor device socket for electrically connecting between a semiconductor device and a printed-wiring board, the semiconductor device socket comprising:

• a socket body having contacts to be electrically contacted with the semiconductor device;
• and
• a connection mechanism provided between the socket body and the printed-wiring board, including connection members for electrically connecting between the contacts and pads of the printed-wiring board and an alignment plate having a cylindrical through-hole in which one of the connection members is provided;
• wherein the connection member provided in the through-hole has a first spring portion having a first free end, a circular support portion having an outer diameter greater than an inner diameter of the through-hole, a positioning portion having an outer diameter smaller than the inner diameter of the through-hole, and a second spring portion having an outer diameter smaller than the inner diameter of the through-hole and having a second free end, and
• the circular support portion abuts against the outer surface of the alignment plate on opposite sides when the positioning portion and the second spring portion of the connection member are inserted in the through-hole, thereby the connection member being retained on the alignment plate.