An interposer for a land grid array (LGA) forming an electrical interconnect structure between electronic components, said interposer comprising at least one dielectric elastic contact button essentially constituted of siloxane, and an electrically conductive material selected from the group of materials consisting of nickel, titanium alloy, copper or gold and other metals, being disposed on the exterior of said at least one contact button providing said electrical interconnect structure, said metal selectively comprising a continuous shell of electrical-conductive material covering the external surface of said at least one elastic contact button, or an intermittent pattern of electrically-conductive material deposited on the external surface of said at least one elastic contact button, said electrically conductive material extending between opposite ends of said contact button.