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AssigneeU-AI Electronics Corporation
InventorsMasanori Takezaki, Masayuki Komaru, Haruki Nitta, Takafumi Yagi, Yoshiyuki Mizuno
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A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.
A printed board that includes an insulator made of an electrical insulating material and a wiring pattern formed on at least one surface of the insulator or on at least one surface of the insulator and inside the insulator and on which one or more electronic components are to be mounted, the printed board comprising:
Dependencies are inferred from the claim text.