Solder interconnect integrity monitor
AssigneeSun Microsystems, Inc.
InventorKeith G. Newman
Life of this patent
Estimating the term…
Abstract
An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across multiple component configurations. Said components can be implemented to detect, on a continuous basis, solder interconnect fractures as they occur during actual end-use, throughout the lifecycle of monitored components, rather than relying on a one-time electrical check prior to shipment.
Claims24
A method of monitoring a solder interconnect, comprising:
- providing electrical current to at least one first solder interconnect within an array of solder interconnects, the at least one first solder interconnect configured differently from the array of solder interconnects such that the at least one first solder interconnect will fail sooner than the array of solder interconnects;
- and
- monitoring said current operable to detect loss of current in said at least one first solder interconnect indicating a failure of said at least one first solder interconnect, wherein said at least one first solder interconnect is formed from solder having a composition with a fracture strength different than the fracture strength of solder interconnects within the array of solder interconnects.
A method of monitoring a solder interconnect, comprising:
- providing electrical current to at least one first solder interconnect within an array of solder interconnects, the at least one first solder interconnect configured differently from the array of solder interconnects such that the at least one first solder interconnect will fail sooner than the array of solder interconnects;
- and
- monitoring said current operable to detect loss of current in said at least one first solder interconnect indicating a failure of said at least one first solder interconnect, wherein said at least one solder interconnect has a different geometry than the array of solder interconnects.
A solder interconnect monitoring system, comprising:
- at least one first solder interconnect within an array of solder interconnects, the at least one first solder interconnect structured differently from the array of solder interconnects such that the at least one first solder interconnect will fail sooner than the array of solder interconnects;
- conductors providing electrical current to said at least one first solder interconnect;
- and
- a current monitor operable to detect loss of current in said at least one first solder interconnect indicating a failure of said solder interconnect, wherein said at least one first solder interconnect is formed from solder having a composition with a fracture strength different than the fracture strength of the array of solder interconnects.
A solder interconnect monitoring system, comprising:
- at least one first solder interconnect within an array of solder interconnects, the at least one first solder interconnect structured differently from the array of solder interconnects such that the at least one first solder interconnect will fail sooner than the array of solder interconnects;
- conductors providing electrical current to said at least one first solder interconnect;
- and
- a current monitor operable to detect loss of current in said at least one first solder interconnect indicating a failure of said solder interconnect, wherein said at least one first solder interconnect is formed with a different geometry than the array of solder interconnects.
Dependencies are inferred from the claim text.