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US 7,476,608 B2Granted
Electrically connecting substrate with electrical device
AssigneeHewlett-Packard Development Company, L.P.
InventorsDavid M. Craig, Chien-Hua Chen
Life of this patent
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Abstract
A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.
Claims12
A method for electrically connecting a substrate with an electrical device mounted on the substrate, comprising:
- forming a ball bond between a first end of a wire and a bonding pad of the substrate;
- forming a reverse-motion loop within the wire by:
- raising the wire above the ball bond, while a clamp through which the wire is extruded is opened;
- moving the wire up and away from the bonding pad of the substrate while the clamp is opened;
- moving the wire up and towards the bonding pad of the electrical device while the clamp is opened;
- closing the clamp;
- moving the wire down and towards the bonding pad of the electrical device while the clamp is closed;
- and,
- forming a bond between a second end of the wire and a bonding pad of the electrical device while the clamp is closed.
6 more elements
A method comprising:
- for each of one or more first bonding pads of a substrate on which an electrical device is mounted, the electrical device having one or more second bonding pads corresponding to the first bonding pads,
- forming a conductive ball at a first end of the wire beneath a capillary device through which a wire is extruded;
- opening a clamp through which the wire is extruded;
- lowering the capillary device towards the first bonding pad until the conductive ball contacts the first bonding pad, resulting in a ball bond at the first bonding pad;
- raising the capillary device above the ball bond while the clamp is opened;
- moving the capillary device up and away from the second bonding pad while the clamp is opened;
- moving the capillary device up and towards the second bonding pad while the clamp is opened;
- closing the clamp;
- moving the capillary device down and towards the second bonding pad while the clamp is closed;
- and,
- forming a bond between a second end of the wire and the second bonding pad while the clamp is closed.
8 more elements
Dependencies are inferred from the claim text.