# US 7,466,519 B2 · Wired circuit board for controlling characteristic impedances of a connection terminal > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,466,519 B2 - Document ID: US7466519B2 - Status: Granted - Kind: B2 - Application number: 10/859,150 - Filed: 2004-06-03 - Published: 2004-12-09 - Granted: 2008-12-16 - Earliest claimed: 2003-06-03 - Assignees: Nitto Denko Corporation - Inventors: Shuichi Wakaki; Tadao Ohkawa; Yasuhito Ohwaki - Web page: https://patentgrep.com/patent/US7466519B2 ## CPC - G11B 5/486: {with provision for mounting or arranging electrical conducting means or circuits on or along the arm assembly} - H05K 3/363: {by soldering} - H05K 1/0237: {High frequency adaptations (H05K1/0216 takes precedence)} - H05K 1/056: {the metal substrate being covered by an organic insulating layer} - H05K 3/0058: {Laminating printed circuit boards onto other substrates, e.g. metallic substrates (H05K1/0281 takes precedence)} - H05K 2201/0367: Metallic bump or raised conductor not used as solder bump - H05K 2201/0715: provided by an outer layer of PCB - H05K 2201/093: Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein - H05K 2201/0969: Apertured conductors - G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A wired circuit board is provided for controlling characteristic impedance at connection points between the read wire and write wire of a suspension board with circuit and terminal portions of the wired circuit board connected thereto. The invention provides improved signal transmission efficiency for fine pitch wiring or for high frequency signal. A conductive board is adhesively bonded to an insulating base layer of the wired circuit board at one side thereof opposite to the other side on which a suspension-board-side connection terminal portion is formed having a first terminal portion that connects with a read wire of the suspension board and a second terminal portion that connects with a write wire of the suspension board. An opening is provided adjacent to one of the first terminal portion and the second terminal portion and a stiffener board is adhesively bonded to the conductive board via an adhesive layer. ## Claims ### Claim 1 A wired circuit board for connecting to an external circuit that includes external read wires and external write wires, the wired circuit board comprising: an insulating layer having a first surface and a second surface that oppose each other; a plurality of read lines formed on the first surface of the insulating layer; a plurality of write lines formed on the first surface of the insulating layer; a connection terminal portion formed on the first surface of the insulating layer to electrically couple the wired circuit board and the external circuit, the connection terminal portion comprising: first terminals that are connected to the plurality of read lines and are configured to be electrically coupled to the external read wires of the external circuit; and second terminals that are connected to the plurality of write lines and are configured to be electrically coupled to the external write wires of the external circuit; a ground layer formed on the second surface of the insulating layer; and an opening formed in the ground layer proximate to the connection terminal portion and positioned to overlap with one of the first terminals or the second terminals and not to overlap with the other of the first terminals or the second terminals, wherein the opening is adapted to control characteristic impedances at the connection terminal portion between the first terminals and the external read wires and between the second terminals and the external write wires; wherein the ground layer comprises: a stiffener board, and a conductive board interposed between the insulating layer and the stiffener board, wherein the opening is formed in the conductive board; wherein the conductive board comprises a metal foil selected from the group consisting of copper, nickel, gold, solder and alloys thereof. ### Claim 2 A wired circuit board for connecting to an external circuit that includes external read wires and external write wires, the wired circuit board comprising: an insulating layer having a first surface and a second surface that oppose each other; a plurality of read lines formed on the first surface of the insulating layer; a plurality of write lines formed on the first surface of the insulating layer; a connection terminal portion formed on the first surface of the insulating layer to electrically couple the wired circuit board and the external circuit, the connection terminal portion comprising: first terminals that are connected to the plurality of read lines and are configured to be electrically coupled to the external read wires of the external circuit; and second terminals that are connected to the plurality of write lines and are configured to be electrically coupled to the external write wires of the external circuit; a ground layer formed on the second surface of the insulating layer; and an opening formed in the ground layer proximate to the connection terminal portion and positioned to overlap with one of the first terminals or the second terminals and not to overlap with the other of the first terminals or the second terminals, wherein the opening is adapted to control characteristic impedances at the connection terminal portion between the first terminals and the external read wires and between the second terminals and the external write wires; wherein the ground layer consists essentially of a stiffener board, and wherein the opening is formed in the stiffener board.