# US 7,466,016 B2 · Bent lead transistor

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- Number: US 7,466,016 B2
- Document ID: US7466016B2
- Status: Granted
- Kind: B2
- Application number: 11/784,763
- Filed: 2007-04-07
- Published: 2008-10-09
- Granted: 2008-12-16
- Earliest claimed: 2007-04-07
- Inventors: Kevin Yang
- Web page: https://patentgrep.com/patent/US7466016B2

## CPC

- H10W 70/481: {for devices being provided for in groups H10D8/00 - H10D48/00}
- H10W 70/429: {being the outer leads}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A metal backing tab supports the semiconductor device and has an extending portion extending from an edge. A top leg, a middle leg and a bottom leg are all coupled to the semiconductor device and each has a lead terminal portion extending beyond the boundary of said molded housing. The top leg has a first top leg section that protrudes directly away from the molded housing, a second top leg section that bends toward a direction of a face of the molded housing, and a third top leg section bending downward. The middle leg has a first middle leg section connected to the package that protrudes away from the molded housing, and a middle leg downward section that points downward. The bottom leg has a first bottom leg section that protrudes away from the molded housing face, a second bottom leg section that points away from the molded housing face, and third bottom leg section that points downward.

## Claims

### Claim 1

A conductive lead frame for supporting a semiconductor device encapsulated in a molded housing, the lead frame comprising:
a metal backing tab which supports the semiconductor device and has an extending portion extending from an edge thereof that extends beyond a boundary of the molded housing; and
a top leg, a middle leg and a bottom leg;
wherein the top leg, the middle leg and the bottom leg are all coupled to the semiconductor device each having a lead terminal portion extending beyond the boundary of said molded housing, wherein each of the three legs protrude from the molded housing,
wherein the top leg has a first top leg section that protrudes directly away from the molded housing, and a second top leg section that bends toward a direction of a face of the molded housing, and a third top leg section bending downward, wherein the middle leg has a first middle leg section connected to the package that protrudes away from the molded housing, and a middle leg downward section that points downward, wherein the bottom leg has a first bottom leg section that protrudes away from the molded housing face, and a second bottom leg section that points away from the molded housing face, and third bottom leg section that points downward,
wherein the metal backing tab is effective to function as a heatsink and extends outside the boundary of the molded housing.

### Claim 2 (depends on 1)

The conductive lead frame of claim 1, wherein the first bottom leg section forms a 120° angle with the second bottom leg section.

### Claim 3 (depends on 1)

The conductive lead frame of claim 1, wherein the first top leg section forms a 120° angle with the second top leg section.

### Claim 4 (depends on 1)

The conductive lead frame of claim 1, wherein the first middle leg section forms a 120° angle with the middle leg downward section.

### Claim 5 (depends on 1)

The conductive lead frame of claim 1, wherein the second bottom leg section forms a 90° angle with the third bottom leg section.

### Claim 6 (depends on 1)

The conductive lead frame of claim 1, wherein the second top leg section forms a 90° angle with the third top leg section.

### Claim 7 (depends on 1)

The conductive lead frame of claim 1, wherein the first bottom leg section forms a 120° angle with the second bottom leg section; the first top leg section forms a 120° angle with the second top leg section; and the first middle leg section forms a 120° angle with the middle leg downward section.

### Claim 8 (depends on 1)

The conductive lead frame of claim 1, wherein the second bottom leg section forms a 90° angle with the third bottom leg section and the second top leg section forms a 90° angle with the third top leg section.

### Claim 9 (depends on 1)

The conductive lead frame of claim 1, wherein the first bottom leg section forms a 120° angle with the second bottom leg section; the first top leg section forms a 120° angle with the second top leg section; the first middle leg section forms a 120° angle with the middle leg downward section; and wherein the second bottom leg section forms a 90° angle with the third bottom leg section and the second top leg section forms a 90° angle with the third top leg section.