# US 7,465,221 B2 · Polishing apparatus

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- Number: US 7,465,221 B2
- Document ID: US7465221B2
- Status: Granted
- Kind: B2
- Application number: 11/878,030
- Filed: 2007-07-20
- Published: 2007-11-22
- Granted: 2008-12-16
- Earliest claimed: 2000-11-29
- Assignees: Renesas Technology Corp.
- Inventors: Masanobu Iwasaki; Yoshio Hayashide
- Web page: https://patentgrep.com/patent/US7465221B2

## CPC

- B24B 37/04: designed for working plane surfaces
- B24B 57/02: for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
- B24C 11/005: {of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form}
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24C: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL

## Abstract

A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of abrasive slurry, the mist of additive and the mist of pure water to prepare polishing solution, and supplies the polishing solution onto the major surface of a polishing stage.

## Claims

### Claim 1

An apparatus including a polishing solution supply system, the polishing solution supply system comprising:
a polishing table for placing a semiconductor substrate on a major surface thereof;
a first supply unit for spraying and supplying a mist comprising abrasive slurry;
a second supply unit for spraying and supplying a mist comprising additive;
a third supply unit for spraying and supplying a mist comprising pure water;
a mixing unit for mixing the mist of abrasive slurry supplied from said first supply unit, the mist of additive supplied from said second supply unit and the mist of pure water supplied from said third supply unit to form a polishing mixture, said mixing unit supplying the polishing mixture onto said major surface for said polishing table; and
a carrier head for pressing said semiconductor substrate against said major surface of said polishing table,
wherein said additive is an aqueous solution of organic acid, or an aqueous solution of hydrogen peroxide.