# US 7,465,142 B2 · Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape

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- Number: US 7,465,142 B2
- Document ID: US7465142B2
- Status: Granted
- Kind: B2
- Application number: 10/981,468
- Filed: 2004-11-05
- Published: 2005-05-05
- Granted: 2008-12-16
- Earliest claimed: 2002-11-11
- Assignees: Samsung Electronics Co., Ltd.
- Inventors: Cheol-Joon Yoo
- Web page: https://patentgrep.com/patent/US7465142B2

## CPC

- H10P 72/74: {using temporarily an auxiliary support}
- H10P 72/0442: {Apparatus for placing on an insulating substrate, e.g. tape}
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10P 72/7414: {the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support}
- H10P 72/7416: {used during dicing or grinding}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method and apparatus for picking up a semiconductor chip, a method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape are provided. Air may be blown through air holes in a dicing tape to at least partially separate the semiconductor chip from the dicing tape and/or create a space between the semiconductor chip to weaken the adhesion of the dicing tape to the semiconductor chip. The semiconductor chip may then be picked up by a removal member and completely removed from the dicing tape. Semiconductor chips that are not to be removed may be vacuum-suctioned to the dicing tape. UV radiation or heat may be applied to weaken the adhesion of the dicing tape. The semiconductor chip may be detected by an optical detector. Removing the semiconductor chips by air reduces stress and damage to the semiconductor chips.

## Claims

### Claim 1

A method for removing a semiconductor chip from a dicing tapes, comprising:
positioning an air dispensing module under the semiconductor chip;
blowing air through a plurality of air-through holes formed in the dicing tape to at least partially separate the semiconductor chip from the dicing tape;
positioning a removal member above the semiconductor chip; and
removing the semiconductor chip from the dicing tape.

### Claim 2 (depends on 1)

The method of claim 1, further comprising:
positioning at least one of the air-through holes in the dicing tape under the semiconductor chip.

### Claim 3 (depends on 2)

The method of claim 2, wherein the blown air is directed toward the semiconductor chip to create a space between the semiconductor chip and the dicing tape.

### Claim 4 (depends on 1)

The method of claim 1, further comprising:
vacuum suctioning semiconductor chips that are not to be removed to the dicing tape.

### Claim 5 (depends on 1)

The method of claim 1, further comprising:
adhering the removal member to a surface of the semiconductor chip.

### Claim 6 (depends on 5)

The method of claim 5, further comprising:
moving the removal member a distance from the dicing tape.

### Claim 7 (depends on 1)

The method of claim 1, further comprising:
vacuum suctioning the dicing tape to the air dispensing module.