# US 7,464,854 B2 · Method and apparatus for forming a low profile wire loop > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 7,464,854 B2 - Document ID: US7464854B2 - Status: Granted - Kind: B2 - Application number: 11/306,678 - Filed: 2006-01-06 - Published: 2006-07-27 - Granted: 2008-12-16 - Earliest claimed: 2005-01-25 - Assignees: Kulicke and Soffa Industries, Inc. - Inventors: Stephen E Babinetz - Web page: https://patentgrep.com/patent/US7464854B2 ## CPC - B23K 20/007: {Ball bonding} - B23K 20/004: {Wire welding} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - H10W 72/07183: {Means for monitoring} - H10W 72/075: {of bond wires} - H10W 72/07511: {Treating the bonding area before connecting, e.g. by applying flux or cleaning} - H10W 72/07521: {Aligning} - H10W 72/07553: {changes in shapes} - H10W 72/531: {Shapes of wire connectors} - H10W 72/536: {the connected ends being ball-shaped} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/5434: {the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires} - H10W 72/5438: {the bond wires having multiple connections on the same bond pad} - H10W 72/552: {comprising metals or metalloids, e.g. silver} - H10W 72/951: {Materials of bond pads} - Y10T 428/12507: More than two components - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A method of bonding a wire between a first bonding location and a second bonding location is provided. The method includes bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond. The method also includes forming a looped portion in the wire adjacent the first wire bond. The method also includes lowering the wire bonding tool in a direction towards the first wire bond after the forming step. The lowering step is interrupted prior to the wire bonding tool contacting the first wire bond. The method also includes bonding a second end of the wire to a second bonding location. ## Claims ### Claim 1 A method of bonding a wire between a first bonding location and a second bonding location, the method comprising the steps of: bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond; forming a fold of wire on top of, and in contact with, the first wire bond such that the fold of wire includes (1) a first portion extending from the first wire bond in a first direction, (2) a second portion extending in a second direction substantially opposite and substantially parallel to the first direction; lowering the wire bonding tool in a direction towards the first wire bond immediately after the forming step, the lowering step being interrupted prior to the wire bonding tool contacting the first wire bond such that the bonding tool does not bond the fold of wire to the first wire bond; and bonding a second end of the wire to a second bonding location. ### Claim 2 (depends on 1) The method of claim 1 wherein the step of lowering includes lowering the wire bonding tool in the direction towards, but to a side of, the first wire bond. ### Claim 3 (depends on 1) The method of claim 1 wherein the step of forming includes: raising the wire bonding tool above the first wire bond, laterally moving the wire bonding tool away from the first wire bond, lowering the wire bonding tool, raising the wire bonding tool, and laterally moving the wire bonding tool towards a position above the first wire bond. ### Claim 4 (depends on 1) The method of claim 1 wherein the step of forming includes: raising the wire bonding tool above the first wire bond, laterally moving the wire bonding tool away from the first wire bond, raising the wire bonding tool, and laterally moving the wire bonding tool towards a position above the first wire bond. ### Claim 5 (depends on 1) The method of claim 1 wherein the step of forming includes: raising the wire bonding tool above the first wire bond, laterally moving the wire bonding tool away from the first wire bond, raising the wire bonding tool, and moving the wire bonding tool along a downward angle towards a position above the first wire bond. ### Claim 6 (depends on 1) The method of claim 1 wherein the step of forming includes: raising the wire bonding tool above the first wire bond, moving the wire bonding tool along a downward angle away from the first wire bond, raising the wire bonding tool, and laterally moving the wire bonding tool towards a position above the first wire bond. ### Claim 7 (depends on 1) The method of claim 1 wherein the step of forming includes: raising the wire bonding tool above the first wire bond, moving the wire bonding tool along a downward angle away from the first wire bond, raising the wire bonding tool, and moving the wire bonding tool along another downward angle towards a position above the first wire bond. ### Claim 8 (depends on 1) The method of claim 1 wherein the step of forming includes: moving the wire bonding tool along an upward angle away from the first wire bond, and laterally moving the wire bonding tool towards a position above the first wire bond. ### Claim 9 (depends on 1) The method of claim 1 wherein the step of forming includes: moving the wire bonding tool along an upward angle away from the first wire bond, and moving the wire bonding tool along another upward angle towards a position above the first wire bond. ### Claim 10 A method of bonding a wire between a first bonding location and a second bonding location, the method comprising the steps of: bonding a first end of a wire to a first bonding location using a wire bonding tool to form a first wire bond; forming a fold of wire on top of, and in contact with, the first wire bond such that the fold of wire includes (1) a first portion extending from the first wire bond in a first direction, (2) a second portion extending in a second direction substantially opposite and substantially parallel to the first direction, the step of forming including in order: raising the wire bonding tool above the first wire bond, moving the wire bonding tool away from the first wire bond, raising the wire bonding tool, and moving the wire bonding tool towards the first wire bond, the moving step being interrupted prior to the wire bonding tool contacting the first wire bond such that the bonding tool does not bond the fold of wire to the first wire bond; and bonding a second end of the wire to a second bonding location. ### Claim 11 (depends on 10) The method of claim 10 wherein the step of moving the wire bonding tool away from the first wire bond includes moving the wire bonding tool along a downward angle away from the first wire bond. ### Claim 12 (depends on 10) The method of claim 10 wherein the step of moving the wire bonding tool away from the first wire bond includes laterally moving the wire bonding tool away from the first wire bond. ### Claim 13 (depends on 10) The method of claim 10 wherein the step of moving the wire bonding tool towards the first wire bond includes moving the wire bonding tool along a downward angle towards the first wire bond. ### Claim 14 (depends on 10) The method of claim 10 wherein the step of moving the wire bonding tool towards the first wire bond includes laterally moving the wire bonding tool towards the first wire bond.