# US 7,464,719 B2 · Multi-menisci processing apparatus

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- Number: US 7,464,719 B2
- Document ID: US7464719B2
- Status: Granted
- Kind: B2
- Application number: 11/437,891
- Filed: 2006-05-18
- Published: 2006-09-21
- Granted: 2008-12-16
- Earliest claimed: 2002-09-30
- Assignees: Lam Research Corporation
- Inventors: James P. Garcia; Mike Ravkin; Carl Woods; Fred C. Redeker; John de Larios
- Web page: https://patentgrep.com/patent/US7464719B2

## CPC

- B08B 3/04: Cleaning involving contact with liquid
- C25D 5/34: Pretreatment of metallic surfaces to be electroplated
- C25D 17/001: {Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells}
- H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like}
- H10P 72/0408: {for drying}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance}
- Y10S 134/902: Semiconductor wafer
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

A substrate preparation apparatus is provided. The apparatus includes a housing configured to be installed in a substrate fabrication facility. The housing includes a manifold for use in preparing a wafer surface. The manifold is configured to include a first process window in a first portion of the manifold. A first fluid meniscus is capable of being defined within the first process windowl. Further included is a second process window in a second portion of the manifold. A second fluid meniscus is capable of being defined within the second process window. An arm is integrated with the housing, and the arm is coupled to the manifold, such that the arm is capable of positioning the manifold in proximity with the substrate during operation. The apparatus therefore provides for the formation of multi-menisci over the surface of a substrate using a single manifold.

## Claims

### Claim 1

A manifold for use in preparing a wafer surface, comprising:
a first process window in a first portion of the manifold being configured generate a first fluid meniscus on the wafer surface, the first portion defining a first manifold surface that is configured to be held in close proximity to the wafer surface so as to contain the first fluid meniscus between the first manifold surface and the wafer surface; and
a second process window in a second portion of the manifold being configured to generate a second fluid meniscus on the wafer surface, the second portion defining a second manifold surface that is confi2ured to be held in close proximity to the wafer surface so as to contain the second meniscus between the second manifold surface and the wafer surface
wherein the first portion of the manifold and the second portion of the manifold are arranged on a same side of the wafer surface such that movement of the wafer surface acts to move the first fluid meniscus and the second fluid meniscus simultaneously over a different portion of the wafer surface.

### Claim 2 (depends on 1)

A manifold for use in preparing a wafer surface as recited in claim 1, wherein the first fluid meniscus cleans the wafer surface and the second fluid meniscus cleans and dries the wafer surface.

### Claim 3 (depends on 1)

A manifold for use in preparing a wafer surface as recited in claim 1, further comprising,
a third process window in a third portion of the manifold being configured to generate a third fluid meniscus on the wafer surface, the third fluid meniscus drying the wafer surface.

### Claim 4 (depends on 1)

A manifold for use in preparing a wafer surface as recited in claim 1, wherein, the first process window is on a leading edge side of the manifold.

### Claim 5

A manifold for use in preparing a wafer surface, comprising:
a head having a surface that is configured to be placed proximate to the wafer surface, the head having a first process window region and a second process window region, each of the first process window region and the second process window region including a plurality of fluid input conduits and a plurality of fluid output conduits, such that the plurality of fluid input conduits are configured to deliver a fluid to the wafer surface and the plurality of fluid output conduits substantially remove the fluid during operation, and such that during operation a first fluid meniscus is defined between the head surface and wafer surface at the first process window region and a second fluid meniscus is defined between the head surface and the wafer surface at the second process window region;
wherein the first process window region and the second process window region are arranged parallel to each other, such that the fluid meniscus of the first process window region and the second process window extend at least a diameter of the wafer surface.

### Claim 6 (depends on 5)

A manifold for use in preparing a wafer surface as recited in claim 5, wherein the fluid meniscus of first process window region and the second process window region define either a same meniscus type or a different meniscus type.

### Claim 7

A substrate preparation apparatus, the apparatus comprising:
a housing configured to be installed in a substrate fabrication facility, the housing including a manifold for use in preparing a wafer surface, the manifold configured to include a first process window in a first portion of the manifold, a first fluid meniscus capable of being defined within the first process window, and a second process window in a second portion of the manifold, a second fluid meniscus capable of being defined within the second process window, within the first portion and the second portion of the manifold extend up to at least a width of the wafer surface, and the portion and second portion and are arranged in a parrallel orientation on a same side of the wafer surface; and
an arm being integrated to the housing, the arm being coupled to the manifold, such that the arm maintains positioning the manifold in proximity with the substrate during operation.

### Claim 8 (depends on 7)

A substrate preparation apparatus as recited in claim 7, wherein the wafer surface enters the housing in a dry state and exits the housing a same dry state.

### Claim 9 (depends on 8)

A substrate preparation apparatus as recited in claim 8, wherein the housing is a process module.

### Claim 10 (depends on 9)

A substrate preparation apparatus as recited in claim 9, wherein the housing includes another manifold for processing an opposite side of the substrate.