Semiconductor laser and the method for manufacturing the same
AssigneeSumitomo Electric Industries, Ltd.
InventorsTakahiko Kawahara, Nobuyuki Ikoma
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Abstract
The present invention is to provide a semiconductor laser with a feedback grating comprised of InP and AlGaInAs without InAsP put therebetween, and to provide a method for manufacturing the DFB-LD having such grating. The LD includes an n-type InP substrate, an AlInAsP intermediate layer, an AlGaInAs lower SCH layer, an active layer, and a p-type layer for upper cladding in this order from the InP substrate. The InP substrate, the AlInAsP intermediate layer, and the AlGaInAs lower SCH layer constitute the feedback grating. The AlInAsP intermediate layer lowers a series resistance along these semiconductor stacks.
Claims5
A semiconductor laser diode, comprising:
- a semiconductor substrate having an undulation for a feedback grating;
- an intermediate layer disposed on the semiconductor substrate and having the same undulation as the substrate;
- a lower separated confinement layer disposed on the intermediate layer, the lower separated confinement layer filling valleys of the undulation of the semiconductor substrate, a top surface of the lower separated confinement layer being substantially flat, the lower separated confinement layer having a refractive index different from a refractive index of the substrate;
- an active layer disposed on the lower separated confinement layer, the active layer generating the light diffracted by the undulation in the substrate;
- and
- an upper separated confinement layer disposed on the active layer,
- wherein the semiconductor substrate, the intermediate layer, and the lower separated confinement layer are n-type InP, AlInAsP, and AlGaInAs, respectively,
- wherein the intermediate layer relaxes a band discontinuity between the lower separated confinement layer and the semiconductor substrate;
- and
- wherein the substrate, the intermediate layer and the lower separated confinement layer forms the feedback grating.
Dependencies are inferred from the claim text.