Heat dissipation assembly
AssigneeFoxconn Technology Co., Ltd.
InventorsNien-Tien Cheng, Chen-Shen Lin
Life of this patent
Estimating the term…
Abstract
A heat dissipation assembly (100) is provided. The heat dissipation assembly (100) comprises a chassis (20) of an electronic product, a heat sink (10) having a bottom portion thereof being insert-molded with the chassis (20) so that the heat sink (10) and the chassis (20) are integrally connected together as a single piece, a base (30) secured to the chassis (20) and having a top surface (32) thermally connecting with a heat generating electronic unit of the electronic product and a bottom surface (34) thermally connecting with the chassis (20), a fan (40) used for cooling the heat sink (10), and a heat pipe (50) having an evaporator section (52) connected with the base (30) and a condenser section (54) connected with the heat sink (10).
Claims17
A heat dissipation assembly comprising:
- a chassis of an enclosure of an electronic product in which a heat generating electronic unit is adapted to be enclosed;
- a heat sink having a bottom portion thereof being insert-molded with said chassis so that the heat sink and said chassis are integrally connected with each other as a single piece;
- a base having a top surface adapted for thermally connecting with the heat generating electronic unit;
- a fan generating an airflow for cooling said heat sink;
- and
- a heat pipe having an evaporator section and a condenser section, the evaporator section thermally connecting with said base and the condenser section thermally connecting with said heat sink, wherein said base has a bottom surface, the bottom surface of said base physically and thermally contacts with said chassis.
A method of producing a heat dissipation assembly for use with an electronic unit enclosed in an enclosure of an electronic product, the enclosure having a chassis, the method comprising steps of:
- insert molding a heat sink with said chassis so that said heat sink and said chassis are integrally connected with each other as a single piece and the heat sink is enclosed in the enclosure of the electronic product;
- thermally attaching a thermally conductive base to said electronic unit;
- mounting a fan at a side of said heat sink;
- and
- thermally interconnecting said base with said heat sink by using a heat pipe.
A heat dissipation assembly comprising:
- a chassis of an enclosure of an electronic product in which a heat generating electronic unit is adapted to be enclosed;
- a heat sink having a bottom portion thereof being insert-molded with said chassis so that the heat sink and said chassis are integrally connected with each other as a single piece;
- a base secured to the chassis and having a top surface adapted for thermally connecting with the heat generating electronic unit;
- a fan generating an airflow for cooling said heat sink;
- and
- a heat pipe having an evaporator section and a condenser section, the evaporator section thermally connecting with said base and the condenser section thermally connecting with said heat sink, wherein said base has a bottom surface, the bottom surface of said base physically and thermally contacts with said chassis.
Dependencies are inferred from the claim text.