Thin multi-terminal capacitor and method of manufacturing the same

A thin multi-terminal capacitor, comprising:

• a stacked structure including an anode made of a valve-acting metal in the form of a thin plate, an oxide layer formed on a surface of said valve-acting metal, and a cathode including a solid electrolyte layer formed on said oxide layer;
• multi-terminal electrodes including anode terminal electrodes and cathode terminal electrodes which are arranged in arrays on one surface of said stacked structure;
• and
• a conductive reinforcing plate disposed on at least one side of said stacked structure for suppressing deformation of said thin multi-terminal capacitor;
• wherein either of said anode terminal electrodes and said cathode terminal electrodes comprise projecting portions of said conductive reinforcing plate which are embossed in arrays and disposed in through holes which are formed across said stacked structure and arranged in arrays.

A thin multi-terminal capacitor manufacturing method comprising:

• forming holes at regular intervals in a valve-acting metal plate having oxide layers formed on both surfaces thereof;
• filling said holes with a first resist resin;
• forming a mask layer covering said first resist resin;
• forming a conductive polymer layer on an exposed surface of a first one of said oxide layers;
• stripping said mask layer to expose surfaces of said first resist resin;
• connecting, via a silver paste layer, a composite foil comprising a first copper foil and an insulating resin film to said conductive polymer layer such that said first copper foil faces toward said conductive polymer layer, said first copper foil being formed with through holes arranged corresponding to the surfaces of said first resist resin, and said insulating resin film being formed with holes arranged to correspond to positions of said through holes and middle points between adjacent through holes;
• filling the holes provided in a composite layer including said insulating resin film, said first copper foil, said silver paste layer, and said conductive polymer layer stacked together, with a second resist resin made of material that is the same as a material of which said first resist resin is made;
• removing a second one of said oxide layers, which is on a side of said valve-acting metal plate opposite to said conductive polymer layer, so as to expose a valve-acting metal core;
• forming through holes at the centers of each of said first and second resist resins;
• and
• mounting a second copper foil having concave-convex portions formed by emboss processing corresponding to the positions of said through holes, to an exposed surface of said valve-acting metal via a silver paste layer at a flat portion of said second copper foil such that said concave-convex portions of said second copper foil are inserted into the through holes, which are provide provided in a composite layer including said insulating resin film, said first copper foil, said silver paste layer, said conductive polymer layer, said oxide layer, and said valve-acting metal core.