Probe interposers and methods of fabricating probe interposers

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• mechanical hard stops on the substrate frontside, the mechanical hard stops having outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer;
• and
• multiple fiducial alignment features received on an individual of the mechanical hard stops, said individual of the mechanical hard stops comprising multiple recesses formed therein relative its outer surface, individual of the multiple fiducial alignment features being received within individual of said multiple recesses.

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• and
• a z-axis detection mechanism on the substrate frontside, the z-axis detection mechanism extending elevationally outward on the substrate frontside a greater distance than the probe tips extend elevationally outward on the substrate frontside.

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• and
• mechanical hard stops on the substrate frontside, the mechanical hard stops having outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer, at least one of the mechanical hard stops comprising multiple recesses formed therein relative its outer surface.

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• and
• mechanical hard stops on the substrate frontside, the mechanical hard stops having outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer, at least one of the mechanical hard stops comprising a recess formed therein relative its outer surface, a circuit component received within the recess.

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• and
• mechanical hard stops on the substrate frontside, the mechanical hard stops having outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer, at least one of the mechanical hard stops comprising a recess formed therein relative its outer surface, an integrated circuit received within the recess.

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• mechanical hard stops on the substrate frontside, the mechanical hard stops having outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer;
• and
• a fiducial alignment feature received on at least one of the mechanical hard stops, at least one of the mechanical hard stops comprising a recess formed therein relative its outer surface, the fiducial alignment feature being received within the recess.

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• and
• mechanical hard stops on the substrate frontside, the mechanical hard stops having outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer, at least one of the mechanical hard stops comprising a mechanical mount feature, the mechanical mount feature comprising a recess formed relative the outer surface, the recess comprising an elongated trench, the mechanical hard stop in which the elongated trench is received comprising outermost lateral edges, the elongated trench extending to the outermost lateral edges.

A probe interposer comprising:

• a substrate comprising a frontside and a backside;
• probe tips on the substrate frontside, the probe tips having electrically conductive outer ends configured to mechanically and electrically engage conductive contact surfaces of a circuit substrate to be probed;
• and
• mechanical hard stops on the substrate frontside, the mechanical hard stops having outer surfaces configured to mechanically engage some surface of the circuit substrate during probe of the circuit substrate with the probe interposer, at least one of the mechanical hard stops comprising a recess formed therein relative its outer surface, the mechanical hard stop in which the recess is received comprising outermost lateral edges, the recess extending to at least one of said outermost lateral edges.