Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device
AssigneeSeiko Epson Corporation
InventorsMitsuaki Harada, Soichi Moriya
Life of this patent
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Abstract
A method for forming a contact hole, a method for manufacturing a circuit board and a method for manufacturing an electro-optical device that increase the reliability of electrical coupling via a conductive part and prevent wire-breaking due to projections when forming a contact hole in an interlayer film by using a needle, and burying a conductive material in the contact hole is provided.
Claims6
A manufacturing apparatus for forming a hole in a film, comprising:
- a needle that is adapted to insert into and perforate the film and to dissolve a part of the film by a solvent, the needle having a hollow structure, the solvent being provided to the film through the hollow structure of the needle.
A manufacturing apparatus for forming a hole in a film, comprising:
- a plurality of needles, each of the plurality of needles being adapted to insert into and perforate the film and to dissolve a part of the film by a solvent, each of the plurality of needles having a hollow structure, the solvent being provided to the film through the corresponding hollow structure.
A manufacturing apparatus for forming a hole in a film, comprising:
- a needle that is adapted to insert into and perforate the film and to dissolve a part of the film by a solvent, the needle having a porous structure, the solvent being provided to the film through the porous structure of the needle.
A manufacturing apparatus for forming a hole in a film, comprising:
- a plurality of needles, each of the plurality of needles being adapted to insert into and perforate the film and to dissolve a part of the film by a solvent, each of the plurality of needles having a porous structure, the solvent being provided to the film through the corresponding porous structure.
Dependencies are inferred from the claim text.