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US 7,459,777 B2Granted
Semiconductor package containing multi-layered semiconductor chips
AssigneeOki Electric Industry Co., Ltd.
InventorAkio Nakamura
Life of this patent
Estimating the term…
Abstract
According to this invention, a semiconductor package includes: a plurality of semiconductor chips, each having through electrodes; and a semiconductor interposer, on which the plurality of semiconductor chips are mounted. Each of the semiconductor chips includes: a semiconductor substrate; a wiring layer formed on the semiconductor substrate; an opaque resin layer sealing the wiring layer and a side surface of the semiconductor chip; and conductive bumps to be connected to the through electrodes.
Claims11
A semiconductor package, comprising:
- a semiconductor interposer;
- a plurality of semiconductor chips mounted on the semiconductor interposer, each chip having through electrodes,
- wherein each of the semiconductor chips includes:
- a semiconductor substrate shaped to have a beveling portion at its peripheral corner;
- a wiring layer formed on the semiconductor substrate;
- an opaque resin layer formed on a surface of the beveling portion, the opaque resin layer sealing the wiring layer;
- and
- conductive bumps to be connected to the through electrodes.
5 more elements
A semiconductor package, comprising:
- a semiconductor interposer;
- a plurality of semiconductor chips mounted on the semiconductor interposer, each semiconductor chip having through electrodes,
- wherein each semiconductor chip includes:
- a semiconductor substrate having an upper surface and a side surface;
- a wiring layer formed on the upper surface of the semiconductor substrate;
- an opaque resin layer covering the upper surface and the side surface of the semiconductor substrate, so that a side surface of the opaque resin layer forms a side surface of each semiconductor chip;
- and
- conductive bumps connected to the through electrodes.
5 more elements
Dependencies are inferred from the claim text.