Stacked chip package using photosensitive polymer and manufacturing method thereof

A semiconductor device comprising:

• a first semiconductor device on a first substrate, the first semiconductor device including a first bonding pad on a first surface of the first substrate in a device region of the first semiconductor device;
• a first interconnect on the first surface of the first substrate, the first interconnect electrically coupled to the first bonding pad,
• a conductive via through the first substrate, the conductive via being electrically coupled to the first interconnect, a portion of the conductive via extending from a second surface of the first substrate opposite the first surface;
• a second semiconductor device on a second substrate, the second semiconductor device including a second bonding pad on a first surface of the second substrate in a device region of the second semiconductor device, the second substrate separated from the first substrate by a space between the first surface of the second substrate and the second surface of the first substrate;
• a second interconnect on the first surface of the second substrate, the second interconnect electrically coupled to the second bonding pad;
• and
• a photosensitive polymer layer filling the space between the first surface of the second substrate and the second surface of the first substrate, and bonding the first and second substrates to each other, the portion of the conductive via extending from the second surface of the first substrate further extending through the photosensitive polymer layer and contacting the second interconnect to electrically couple the first bonding pad to the second bonding pad.