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US 7,459,773 B2Granted
Stackable ball grid array
AssigneeMicron Technology, Inc.
InventorsTodd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley, David J. Corisis
Life of this patent
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Abstract
A memory package having a plurality of vertically stacked ball grid arrays. Each of the vertically stacked ball grid arrays has a memory chip coupled thereto. Further, each of the plurality of ball grid arrays includes non-metal mateable alignment features. Each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays to from the vertically stacked memory package.
Claims13
A memory package comprising:
- a plurality of vertically stacked ball grid arrays, wherein each of the plurality of ball grid arrays comprises a plurality of non-metal mateable alignment features, and wherein each of the plurality of ball grid arrays is coupled to another of the plurality of ball grid arrays;
- and
- a plurality of memory chips, wherein each of the plurality of memory chips is coupled to a respective one of the plurality of ball grid arrays.
Dependencies are inferred from the claim text.