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US 7,459,771 B2Granted
Assembly structure for electronic power integrated circuit formed on a semiconductor die and corresponding manufacturing process
AssigneeSTMicroelectronics S.r.l.
InventorsPaolo Casati, Amedeo Maierna, Bruno Murari
Life of this patent
Estimating the term…
Abstract
An assembly structure for an electronic integrated power circuit, which circuit is fabricated on a semiconductor die having a plurality of contact pads associated with said integrated circuit and connected electrically to respective leads of said structure, wherein a shield element is coupled thermally to said die by a layer of an adhesive material.
Claims4
An integrated circuit, comprising:
- a semiconductor die having a first side and a contact pad disposed on the first side;
- a lead welded to and in electrical connection with the contact pad and having a welded portion spaced a first distance from the first side of the die, wherein the welded portion of the lead is unencapsulated;
- and
- an electromagnetic shield not overlapping the contact pad and thermally coupled to the first side of the semiconductor die by an adhesive layer with no electrical interconnects to the shield and the die through the adhesive layer and spaced a second distance from the first side of the die, the second distance greater than or equal to the first distance.
1 more element
An integrated circuit, comprising:
- a semiconductor die having a first side and a contact pad disposed on the first side;
- a lead welded to and in electrical connection with the contact pad and having a welded portion spaced a first distance from the first side of the die, wherein the lead comprises first, second and third sections, the first and second sections having an obtuse inner angle, and the second and third sections having an obtuse inner;
- and
- an electromagnetic shield not overlapping the contact pad and thermally coupled to the first side of the semiconductor die by an adhesive layer with no electrical interconnects to the shield and the die through the adhesive layer and spaced a second distance from the first side of the die, the second distance greater than or equal to the first distance.
1 more element
Dependencies are inferred from the claim text.