Semiconductor apparatus with decoupling capacitor
AssigneeOki Electric Industry Co., Ltd.
InventorsMakoto Terui, Noritaka Anzai
Life of this patent
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Abstract
A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power supply terminals, in which a pair of adjacent inner leads for power supply terminal and ground terminal are extended inwardly; a chip capacitor mounting pad which is provided at inner ends of the extended inner leads; and a chip capacitor which is mounted on the chip capacitor mounting pad so that a decoupling capacitor is provided.
Claims5
A semiconductor apparatus, comprising:
- an organic material substrate;
- a die pad formed on the organic material substrate and comprised of first and second areas on which a semiconductor chip is mounted;
- ground terminals which are to be grounded;
- power supply terminals which are supplied with electrical power;
- first conductive patterns which are formed on the organic material substrate and are connected to the ground terminals and the first area of the die pad;
- second conductive patterns which are formed on the organic material substrate and are connected to the power supply terminals and the second area of the die pad;
- and
- chip capacitors which are arranged so that a decoupling capacitor is provided,
- wherein the organic material substrate is provided with cavities at a region between the first and second areas of the die pad, and the chip capacitors are arranged in the cavities.
Dependencies are inferred from the claim text.