Polishing method for semiconductor substrate, and polishing jig used therein
AssigneeOpnext Japan, Inc.
InventorsRyu Washino, Yasushi Sakuma, Masaru Mukaikubo, Hura Harpreet Singh, Kenji Uchida
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Abstract
During the polishing of a semiconductor substrate, the semiconductor wafer that has been reduced in thickness, and hence in strength, by polishing, suffers outer-surface damage (or cracking) due to the initial damage caused by the use of polishing quartz. In order to solve these problems, the present invention applies a semiconductor substrate fixing jig formed with, on the face for fixing the semiconductor substrate, a groove(s) of almost the same diameter as that of the semiconductor substrate. Semiconductor substrate damage and cracking can be suppressed by applying this jig.
Claims9
A method for polishing a semiconductor wafer, said method including the steps of:
- fixing, by use of wax, a patterned face of said semiconductor wafer to a groove in a polishing jig having corrosion resistance to a polishing slurry, said groove having a diameter greater than a diameter of said semiconductor wafer by a maximum of 5 mm, covering an entire side surface of said semiconductor wafer in said groove with said wax by filling between said semiconductor wafer and said groove with said wax;
- and
- moving a nonpatterned face of said semiconductor wafer along the surface of a surface plate while said semiconductor wafer is in a pressed condition against said surface plate to which said polishing slurry is supplied.
Dependencies are inferred from the claim text.