Dissociated fabrication of packages and chips of integrated circuits

A method of fabricating a semiconductor component, the method comprising:

• forming a trace attached to a substrate and made solely of conductive metal, said conductive metal trace having a first end and a second end;
• providing a frame structure having a rim at least partially defining a first recess for receiving a semiconductor circuit and a bore;
• filling the bore with a solder material to form a lead-through contact;
• positioning said bore of said frame structure filled with said solder material to contact said first end of said metal trace on the substrate;
• reflowing said solder material filling the bore to attach the first end of the metal trace to the frame structure;
• detaching the metal trace from the substrate such that the first end of the metal trace is supported by the rim of the frame structure and the reflowed solder material in said lead-through contact so that the second end of the metal trace is cantilevered over said recess;
• adhering a semiconductor chip to a dummy substrate;
• positioning the semiconductor chip within the first recess of the frame structure such that said semiconductor chip is embedded within said rim of the frame structure;
• attaching the semiconductor chip to the rim of the frame structure;
• removing the dummy substrate from the semiconductor chip;
• and
• physically connecting a contact region on a surface of the semiconductor chip directly to the cantilevered second end of said metal trace of the frame structure such that the contact region is electrically coupled to the lead-through contact via the metal trace.