Flip-chip semiconductor device manufacturing method

A semiconductor device manufacturing method comprising the following processing steps:

• connecting a plurality of electrodes arranged in a two-dimensional array on a principal surface of a semiconductor package to corresponding conductive regions on a substrate;
• transporting the semiconductor package connected to the substrate into a vacuum chamber;
• injecting an underfill resin onto the substrate from a side surface of the semiconductor package in a vacuum atmosphere to fill a spacing between the semiconductor package and the substrate;
• exposing the semiconductor package and substrate with said supplied underfill resin to atmospheric pressure.

A semiconductor device manufacturing method comprising the following processing steps:

• connecting a plurality of electrodes, arranged in a two-dimensional array on a principal surface of a first semiconductor package, to corresponding conductive regions on a principal surface of a second semiconductor package;
• transporting the first semiconductor package connected to the second semiconductor package into a vacuum chamber;
• injecting an underfill resin onto the principal surface of the second semiconductor package from a side surface of the first semiconductor package in a vacuum atmosphere to fill a spacing between the first semiconductor package and the second semiconductor package;
• exposing the first and second semiconductor packages with said supplied underfill resin to atmospheric pressure.