Method of manufacturing quartz crystal vibrating piece
AssigneeSeiko Instruments Inc.
InventorKiyoshi Aratake
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a quartz crystal vibrating piece is provided. Etching masks of different sizes are each arranged on respective front and rear surfaces of a quartz crystal wafer such that the etching mask on one of the surfaces (e.g., the rear surface) is larger than the other etching mask. The quartz crystal wafer is etched using the etching masks so that a projection is formed on a side of the quartz crystal wafer due to the difference in size of the etching masks, and is overetched to remove the projection.
Claims11
A method of manufacturing a quartz crystal vibrating piece, comprising:
- providing a quartz crystal wafer having front and rear surfaces;
- arranging a reference mask on one of the front and rear surfaces of the quartz crystal wafer;
- arranging a relative mask that is larger than the reference mask on the other of the front and rear surfaces of the quartz crystal wafer;
- and
- etching the quartz crystal wafer from the front and rear surfaces thereof using the reference mask and the relative mask so that a projection is formed on a side of the quartz crystal wafer by the reference mask and overetching the quartz crystal wafer to remove the projection.
A method of manufacturing a quartz crystal vibrating piece, comprising:
- providing a quartz crystal wafer having front and rear surfaces;
- arranging a reference mask on one of the front and rear surfaces of the quartz crystal wafer;
- arranging on the other of the front and rear surfaces of the quartz crystal wafer a relative mask that is larger than the reference mask so that the reference mask is offset in the width or length direction thereof with respect to the relative mask by an amount of not more than 10 μm;
- and
- etching the quartz crystal wafer using the reference mask and the relative mask.
A method of manufacturing a quartz crystal vibrating piece, comprising:
- providing a quartz crystal wafer having front and rear surfaces;
- arranging a first etching mask on the front surface of the quartz crystal wafer;
- arranging a second etching mask on the rear surface of the quartz crystal wafer so that the second etching mask is displaced in a width or length direction thereof with respect to the first etching mask;
- and
- etching the quartz crystal wafer using the first and second etching masks.
Dependencies are inferred from the claim text.