Back to results
US 7,459,198 B2Granted
Stress relief for electroplated films
AssigneeHitachi Global Storage Technologies Netherlands B.V.
InventorsChristian R. Bonhote, Heather K. DeSimone, John W. Lam, Matthew W. Last, Edward Hin Pong Lee, Ian R. McFadyen
Life of this patent
Estimating the term…
Abstract
An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.
Claims25
A method comprising:
- providing a substrate;
- depositing a seed layer over the substrate;
- and
- electroplating over the seed layer a plated layer with a frame pattern having at least one permanent feature surrounded by a plurality of individual features that define a plating field for the at least one permanent feature;
- wherein there are more individual features in the plurality of individual features that define the plating field than permanent features in the at least one permanent feature.
2 more elements
A structure comprising:
- a substrate;
- a seed layer disposed over the substrate;
- and
- a mask disposed over the seed layer, the mask defining a frame pattern having at least one permanent feature and a surrounding plating field, the plating field comprised of a plurality of individual features associated with the permanent feature;
- wherein there are more individual features in the plurality of individual features than permanent features in the at least one permanent feature.
2 more elements
Dependencies are inferred from the claim text.