Heated medium supplying method and structure for secondary molding of resin molded component

A heated medium supply device for secondary molding of a resin molded component,

• wherein a plurality of segmented primary molded components are set in a secondary molding die and a heated medium is supplied to a flow path of a secondary molding resin material, which flow path forms a join for coupling the plurality of segmented primary molded components;
• wherein the secondary molding die includes a housing formed with a path to convey the heated medium toward a flow path of the resin molded component and a bypass to discharge the heated medium out of the die,
• the device further including a heated medium generator to supply the heated medium to bypass the flow path and the of the housing, a nozzle arranged at a forward end of the heated medium generator and a guide hole formed in the housing to slidably guide the nozzle;
• and
• wherein an ejection port formed on the nozzle is adapted to move between a first position to close a passage leading to the flow path and open the bypass and a second position to close the bypass and open the passage leading to the flow path.

A heated medium supply structure comprising:

• a housing;
• and a heated medium generator with a forward end thereof arranged slidably in the housing;
• wherein the housing includes a first path to discharge a heated medium out of the housing through a bypass and a second path to convey the heated medium toward a main path;
• wherein the heated medium generator includes a nozzle arranged at a forward end of the heated medium supply structure to supply the heated medium to each path of the housing;
• and
• wherein an ejection port of the nozzle is adapted to move along a guide hole formed in the housing between a first position to close a passage leading to the main path and open the bypass and a second position to close the bypass and open the passage leading to the main path.