Chemical mechanical polishing pad and methods of making and using same
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorRavichandra V. Palaparthi
Life of this patent
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Abstract
Shape memory chemical mechanical polishing pads are provided, wherein the shape memory chemical mechanical polishing pads comprise a polishing layer in a densified state. Also provided are methods of making the shape memory chemical mechanical polishing pads and for using them to polish substrates.
Claims11
A shape memory chemical mechanical polishing pad for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate;
- comprising:
- a polishing layer set in a densified state;
- wherein the polishing layer comprises a shape memory matrix material transformable between an original shape and a programmed shape;
- wherein the polishing layer exhibits an original thickness, OT, when the shape memory matrix material is in its original shape;
- wherein the polishing layer exhibits a densified thickness, DT, in the densified state when the shape memory matrix material is fixed in the programmed shape;
- wherein the DT is ≦80% of the OT;
- and,
- wherein the polishing layer has a polishing surface adapted for polishing the substrate.
A method for producing a shape memory chemical mechanical polishing pad, comprising:
- providing a shape memory matrix material transformable between an original shape and a programmed shape;
- preparing a polishing layer in an original state exhibiting an original thickness, OT, comprising the shape memory matrix material in the original shape;
- subjecting the polishing layer to an external force;
- setting the shape memory matrix material to the programmed shape to provide the polishing layer in a densified state, wherein the polishing layer exhibits a densified thickness, DT;
- removing the external force;
- wherein the DT is ≦80% of the OT;
- and,
- wherein the polishing layer has a polishing surface adapted for polishing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate.
A method of polishing a substrate, comprising:
- providing a substrate selected from at least one of a magnetic substrate, an optical substrate and a semiconductor substrate;
- providing a shape memory chemical mechanical polishing pad, wherein the polishing pad comprises a polishing layer in a densified state, wherein the polishing layer comprises a shape memory matrix material transformable from an original shape and a programmed shape;
- wherein the polishing layer in its original state exhibits an original thickness, OT, when the shape memory matrix material is in the original shape;
- wherein the polishing layer exhibits a densified thickness, DT, in the densified state when the shape memory matrix material is in the programmed shape;
- and wherein the DT is ≦80% of the OT;
- and,
- creating dynamic contact between a polishing surface of the polishing layer and the substrate to polish a surface of the substrate.
Dependencies are inferred from the claim text.